TEM1-010012A-NM-3B
Micro TEC
TEM1-010012A-NM-3B 2.6x1.8x0.8 mm
| Material |
1
| PN pellets:10 pairs |
| 2 | Cold and hot surface ceramic substrate material: ALN |
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um |
| 4 | Solder layer material composition: Au78Sn22; Maximum allowable process temperature 265℃, 2min |
| Parameter |
| TEM1-010012A-NM-3B | △Tmax/℃ | Qc max/W | Umax/V | Imax/A |
| Th=27℃ | 70.92 | 0.87 | 1.15 | 1.21 |
| Th=85℃ | 93.97 | 1.10 | 1.50 | 1.18 |
| Ta=27℃ | ACR/ Ω：0.74-0.90 |
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