TEM1-03901-6.05x14.4-1.65
Micro TEC
TEM1-03901-6.05x14.4-1.65
| Material |
1
| PN pellets:15 pairs |
| 2 | Cold and hot surface ceramic substrate material: AL203 |
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um |
| 4 | Solder layer material composition: AuSn |
| Parameter |
|
| TEM1-03901-6.05x14.4-1.65 | △Tmax/℃ | Qc max/W | Imax/V | Umax/A
| ACR |
| 298K Vacuum | 64
| 3.2 | 1.1 | 4.76 | 2.97~3.3~3.63 |
| 323K | 72 | 3.7 | 1.18
| 5.16
| 3.35~3.72~4.1 |
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