

TEM1-01201-1.5x2.5-0.8
Micro TEC
TEM1-01201-1.5x2.5-0.8
| Material | ||||
| 1 | PN pellets:15 pairs | |||
| 2 | Cold and hot surface ceramic substrate material: AL203 | |||
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um | |||
| 4 | Solder layer material composition: AuSn | |||
| Parameter | |||||
| TEM1-01201-1.5x2.5-0.8 | △Tmax/℃ | Qc max/W | Imax/V | Umax/A | ACR |
| 27℃ | 69 | 0.7 | 0.71 | 1.58 | 1.51~1.68~1.85 |
| 75℃ | 88 | 0.9 | 0.81 | 1.8 | 1.88~2.09~2.3 |
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