

TEM1-0801-1.6X2.2-0.9
Micro TEC
TEM1-0801-1.6X2.2-0.9
| Material | ||||
| 1 | PN pellets:15 pairs | |||
| 2 | Cold and hot surface ceramic substrate material: AL203 | |||
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um | |||
| 4 | Solder layer material composition: AuSn | |||
| Parameter | |||||
| TEM1-0801-1.6X2.2-0.9 | △Tmax/℃ | Qc max/W | Imax/V | Umax/A | ACR |
| 300K Vaccum | ≥68 | 0.71 | 1.2 | 1 | 0.56~0.66~0.76 |
| 323K N₂ | ≥76 | 0.82 | 1.24 | 1.07 | 0.63~0.73~0.83 |
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