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Multifunctional solution Micro TEC Thermoelectric cooler(TEC) Thermoelectric Cooling Assembly（TEA） Thermoelectric generator(TEG)
TEM1-01401-1.2x2.6-0.8
Micro TEC
TEM1-01401-1.2x2.6-0.8
Material
1
PN pellets:15 pairs
2Cold and hot surface ceramic substrate material: AL203
3Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

4Solder layer material composition: AuSn


Parameter
TEM1-01401-1.2x2.6-0.8

△Tmax/℃

Qc max/WImax/V

Umax/A


ACR
300K  Vacuum700.520.461.852.76~3.06~3.37
323K   N₂790.600.481.993.07~3.41~3.76



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