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Multifunctional solution Micro TEC Thermoelectric cooler(TEC) Thermoelectric Cooling Assembly（TEA） Thermoelectric generator(TEG)
TES1-2402-6.1*9.2*1.65
Micro TEC
TES1-2402-6.1*9.2*1.65
Material
1
PN pellets:15 pairs
2Cold and hot surface ceramic substrate material: AL203
3Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

4Solder layer material composition: AuSn


Parameter
TES1-2402-6.1*9.2*1.65

△Tmax/℃

Qc max/WImax/V

Vmax/V


Th=25℃≥693.572.32.7
Th=50℃76
4.172.33.1
Th=75℃834.46
2.33.5
25℃ ACR（Ω ±7%1.050


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