





TEM1-008012A-NM-3B
Micro TEC
TEM1-008012A-NM-3B 2.2x1.6x0.9 mm
Material | ||||
1 | PN pellets:8 pairs | |||
2 | Cold and hot surface ceramic substrate material: ALN | |||
3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um; Pad partial metallization layer :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um | |||
4 | Solder layer material composition: AuSn |
Parameter | ||||
TEM1-008012A-NM-3B | △Tmax/℃ | Qc max/W | Umax/V | Imax/A |
Th=27℃ | 70 | 0.64 | 0.96 | 1.09 |
Th=50℃ | 79 | 0.74 | 1.03 | 1.16 |
Ta=25℃ | ACR/ Ω:0.58-0.74 |
TEM1-008012A-NM-3B