TEM1-008012A-NM-3B
Micro TEC
TEM1-008012A-NM-3B 2.2x1.6x0.9 mm
| Material |
| 1 | PN pellets:8 pairs |
| 2 | Cold and hot surface ceramic substrate material: ALN |
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um; Pad partial metallization layer :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um |
| 4 | Solder layer material composition: AuSn |
| Parameter |
| TEM1-008012A-NM-3B | △Tmax/℃ | Qc max/W | Umax/V | Imax/A |
| Th=27℃ | 70
| 0.64 | 0.96
| 1.09 |
| Th=50℃ | 79 | 0.74 | 1.03 | 1.16
|
| Ta=25℃ | ACR/ Ω：0.58-0.74 |
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