

TEM1-0901-1.4x3.6-0.9
Micro TEC
TEM1-0901-1.4x3.6-0.9
| Material | ||||
| 1 | PN pellets:15 pairs | |||
| 2 | Cold and hot surface ceramic substrate material: AL203 | |||
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um | |||
| 4 | Solder layer material composition: AuSn | |||
| Parameter | |||||
| TEM1-0901-1.4x3.6-0.9 | △Tmax/℃ | Qc max/W | Imax/V | Umax/A | ACR |
| 300K Vaccum | 72 | 0.78 | 1.45 | 1.19 | 0.72~0.81~0.9 |
| 358K | 81 | 0.9 | 1.56 | 1.28 | 0.81~0..9~0.99 |
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