Cn

En Ar De Es Jap Cn Kr Pt In Bs

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TEM1-0901-1.4x3.6-0.9
Micro TEC
TEM1-0901-1.4x3.6-0.9
Material
1
PN pellets:15 pairs
2Cold and hot surface ceramic substrate material: AL203
3Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

4Solder layer material composition: AuSn


Parameter
TEM1-0901-1.4x3.6-0.9

△Tmax/℃

Qc max/WImax/V

Umax/A


ACR
300K Vaccum720.781.451.190.72~0.81~0.9
358K810.91.561.280.81~0..9~0.99