TEM1-015014A-OM-3B
Micro TEC
TEM1-015014A-OM-3B 3.6x3.2x0.95 mm
| Material |
1
| PN pellets:15 pairs |
| 2 | Cold and hot surface ceramic substrate material: AL203 |
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um |
| 4 | Solder layer material composition: AuSn |
| Parameter |
| TEM1-015014A-0M-3B | △Tmax/℃ | Qc max/W | Umax/V | Imax/A
|
| Th=27℃ | 70.4 | 1.46 | 1.80
| 1.4
|
| Th=50℃ | 79.2 | 1.68 | 1.94 | 1.36 |
| Ta=25℃ | ACR/ Ω：0.965-1.180 |
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