





TEM1-015014A-OM-3B
Micro TEC
TEM1-015014A-OM-3B 3.6x3.2x0.95 mm
| Material | ||||
| 1 | PN pellets:15 pairs | |||
| 2 | Cold and hot surface ceramic substrate material: AL203 | |||
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um | |||
| 4 | Solder layer material composition: AuSn | |||
| Parameter | ||||
| TEM1-015014A-0M-3B | △Tmax/℃ | Qc max/W | Umax/V | Imax/A |
| Th=27℃ | 70.4 | 1.46 | 1.80 | 1.4 |
| Th=50℃ | 79.2 | 1.68 | 1.94 | 1.36 |
| Ta=25℃ | ACR/ Ω:0.965-1.180 | |||
TEM1-015014A-OM-3B
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