

TEM1-0901-1.4x3.6-1.1
Micro TEC
TEM1-0901-1.4x3.6-1.1
| Material | ||||
| 1 | PN pellets:15 pairs | |||
| 2 | Cold and hot surface ceramic substrate material: AL203 | |||
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um | |||
| 4 | Solder layer material composition: AuSn | |||
| Parameter | |||||
| TEM1-0901-1.4x3.6-1.1 | △Tmax/℃ | Qc max/W | Imax/V | Umax/A | ACR |
| 300K Vaccum | 69 | 0.61 | 0.83 | 1.19 | 0.97~1.08~1.19 |
| 323K | 78 | 70 | 0.89 | 1.28 | 1.08~1.21~1.34 |
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