

TEM1-01201-1.6x3.0-0.9
Micro TEC
TEM1-01201-1.6x3.0-0.9
| Material | ||||
| 1 | PN pellets:15 pairs | |||
| 2 | Cold and hot surface ceramic substrate material: AL203 | |||
| 3 | Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um | |||
| 4 | Solder layer material composition: AuSn | |||
| Parameter | |||||
| TEM1-01201-1.6x3.0-0.9 | △Tmax/℃ | Qc max/W | Imax/V | Umax/A | ACR |
| 300K Vacuum | 70 | 1.2 | 1.2 | 1.58 | 0.87~0.97~1.07 |
| 323K | 78 | 1.38 | 1.3 | 1.7 | 0.97~1.08~1.2 |
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