Kr

En Ar De Es Jap Cn Kr Pt In Bs

제품
고객에게 전문 반도체 열전 기술 솔루션 및 어플리케이션 제공
현재 위치:첫 페이지 > 제품
TEM1-01201-1.6x3.0-0.9
Micro TEC
TEM1-01201-1.6x3.0-0.9
Material
1
PN pellets:15 pairs
2Cold and hot surface ceramic substrate material: AL203
3Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 

4Solder layer material composition: AuSn


Parameter
TEM1-01201-1.6x3.0-0.9

△Tmax/℃

Qc max/WImax/V

Umax/A


ACR
300K  Vacuum701.21.21.580.87~0.97~1.07
323K781.381.3
1.70.97~1.08~1.2