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उत्पादनउत्पादन श्रेणी
| PN | lmax(A) | Umax(V) | ΔT Max(℃) | QCmax(W) | W*Lc*Lh*H |
| TEM1-008012A-NM-3B | 1.2 | 1 | 80 | 0.7 | 1.6*1.6*2.2*0.9 |
TEM1-007010A-NM-3B | 1 | 0.9 | 80 | 0.6 | 1.25*2.1*2.65*0.8 |
TEM1-010010B-NM-3B | 1 | 1.3 | 80 | 0.8 | 1.52*2*2.6*0.8 |
TEM1-010012A-NM-3B | 1 | 1.5 | 80 | 1 | 1.8*2*2.6*0.8 |
TEM1-015010A-NM-3B | 1 | 1.9 | 80 | 1.2 | 1.8*2*2.6*0.8 |
| TEM1-012012B-NM-3B | 1.2 | 1.7 | 80 | 1.2 | 2*2*2.7*0.8 |
TEM1-018010B-NM-3B | 1 | 2.6 | 80 | 1.6 | 2*2*2.7*0.8 |
TEM1-012012A-NM-3B | 1.2 | 1.6 | 80 | 1.2 | 1.6*2.4*3*0.8 |
TEM1-014009A-NM-3B | 0.9 | 2 | 80 | 1.1 | 1.38*2.8*3.2*0.9 |
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TEM1-015014A-OM-3BMaterial 1 PN pellets:15 pairs 2 Cold and hot surface ceramic substrate material: AL203 3 Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4 Solder layer material composition: AuSn Parameter TEM1-015014A-0M-3B △Tmax/℃
Qc max/W Umax/V Imax/A
Th=27℃ 70.4 1.46 1.80 1.4 Th=50℃ 79.2 1.68 1.94 1.36 Ta=25℃ ACR/ Ω：0.965-1.180 -
TEM1-010012A-NM-3BMaterial 1 PN pellets:10 pairs 2 Cold and hot surface ceramic substrate material: ALN 3 Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um 4 Solder layer material composition: Au78Sn22; Maximum allowable process temperature 265℃, 2min Parameter TEM1-010012A-NM-3B △Tmax/℃ Qc max/W Umax/V Imax/A Th=27℃ 70.92 0.87 1.15 1.21 Th=85℃ 93.97 1.10 1.50 1.18 Ta=27℃ ACR/ Ω：0.74-0.90 -
TEM1-008012A-NM-3BMaterial 1 PN pellets:8 pairs 2 Cold and hot surface ceramic substrate material: ALN 3 Surface metallized layer material composition :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um; Pad partial metallization layer :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um
4 Solder layer material composition: AuSn Parameter TEM1-008012A-NM-3B △Tmax/℃ Qc max/W Umax/V Imax/A Th=27℃ 70 0.64 0.96 1.09 Th=50℃ 79 0.74 1.03 1.16 Ta=25℃ ACR/ Ω：0.58-0.74 -
TEM1-018010B-NM-3BMaterial 1 PN pellets:18 pairs 2 Cold and hot surface ceramic substrate material: ALN 3 Surface metallized layer material composition: Cu/Ni/Pd/Au: Thickness: 20um/3~7um/0.075um/0.1~0.15um 4 Solder layer material composition: AuSn; Maximum allowable process temperature 265℃, 2min Parameter TEM1-018010B-NM-3B △Tmax/℃ Qc max/W Umax/V Imax/A Th=27℃ 70.3 1.3 2.1 1.0 Th=50℃ 81.6 1.4 2.3 1.0 Ta=27℃ ACR/ Ω：1.576±10%
