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多機能ソリューション Micro TEC ねつでんれいきゃくき(TEC) 熱電冷却アセンブリ（TEA）温度差発電素子 (おんどさはつでんそし)

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PN	lmax(A)	Umax(V)	ΔT Max(℃)	QCmax(W)	WLcLh*H
TEM1-008012A-NM-3B	1.2	1	80	0.7	1.61.62.2*0.9
TEM1-007010A-NM-3B	1	0.9	80	0.6	1.252.12.65*0.8
TEM1-010010B-NM-3B	1	1.3	80	0.8	1.5222.6*0.8
TEM1-010012A-NM-3B	1	1.5	80	1	1.822.6*0.8
TEM1-015010A-NM-3B	1	1.9	80	1.2	1.822.6*0.8
TEM1-012012B-NM-3B	1.2	1.7	80	1.2	222.7*0.8
TEM1-018010B-NM-3B	1	2.6	80	1.6	222.7*0.8
TEM1-012012A-NM-3B	1.2	1.6	80	1.2	1.62.43*0.8
TEM1-014009A-NM-3B	0.9	2	80	1.1	1.382.83.2*0.9
TEM1-03901-6.05x14.4-1.65	1.1	4.76	64	3.2	6.0514.41.65
TEM1-03502-6.05x12.2-1.65	2.0	4.59	68	5.69	6.0512.21.65
TEM1-01401-1.2x2.6-0.8	0.46	1.85	70	0.52	1.22.60.8
TEM1-01201-1.6x3.0-0.9	1.2	1.58	70	1.2	1.63.00.9
TEM1-01201-1.5x2.5-0.8	0.71	1.58	69	0.7	1.52.50.8
TEM1-0901-1.4x3.6-0.9	1.45	1.19	72	0.78	1.43.60.9
TEM1-0901-1.4x3.6-1.1	0.83	1.19	69	0.61	1.43.61.1
TEM1-0801-1.6X2.2-0.9	1.2	1	≥68	0.71	1.62.20.9

TES1-2402-6.1*9.2*1.65

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TES1-2402-6.19.21.65	△Tmax/℃	Qc max/W	Imax/V	Vmax/V
Th=25℃	≥69	3.57	2.3	2.7
Th=50℃	76	4.17	2.3	3.1
Th=75℃	83	4.46	2.3	3.5
25℃ ACR（Ω ±7%	1.050

TEM1-0801-1.6X2.2-0.9

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-0801-1.6X2.2-0.9	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
300K Vaccum	≥68	0.71	1.2	1	0.56~0.66~0.76
323K N₂	≥76	0.82	1.24	1.07	0.63~0.73~0.83

TEM1-0901-1.4x3.6-1.1

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-0901-1.4x3.6-1.1	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
300K Vaccum	69	0.61	0.83	1.19	0.97~1.08~1.19
323K	78	70	0.89	1.28	1.08~1.21~1.34

TEM1-0901-1.4x3.6-0.9

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-0901-1.4x3.6-0.9	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
300K Vaccum	72	0.78	1.45	1.19	0.72~0.81~0.9
358K	81	0.9	1.56	1.28	0.81~0..9~0.99

TEM1-01201-1.5x2.5-0.8

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-01201-1.5x2.5-0.8	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
27℃	69	0.7	0.71	1.58	1.51~1.68~1.85
75℃	88	0.9	0.81	1.8	1.88~2.09~2.3

TEM1-01201-1.6x3.0-0.9

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-01201-1.6x3.0-0.9	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
300K Vacuum	70	1.2	1.2	1.58	0.87~0.97~1.07
323K	78	1.38	1.3	1.7	0.97~1.08~1.2

TEM1-01401-1.2x2.6-0.8

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-01401-1.2x2.6-0.8	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
300K Vacuum	70	0.52	0.46	1.85	2.76~3.06~3.37
323K N₂	79	0.60	0.48	1.99	3.07~3.41~3.76

TEM1-03502-6.05x12.2-1.65

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-03502-6.05x12.2-1.65	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
25℃	68	5.69	2.0	4.59	1.53~1.71~1.88
75℃	88	7.68	2.3	5.36	1.93~2.15~2.37

TEM1-03901-6.05x14.4-1.65

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-03901-6.05x14.4-1.65	△Tmax/℃	Qc max/W	Imax/V	Umax/A	ACR
298K Vacuum	64	3.2	1.1	4.76	2.97~3.3~3.63
323K	72	3.7	1.18	5.16	3.35~3.72~4.1

TEM1-015014A-OM-3B

Material
1	PN pellets:15 pairs
2	Cold and hot surface ceramic substrate material: AL203
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um Pad metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: AuSn

Parameter
TEM1-015014A-0M-3B	△Tmax/℃	Qc max/W	Umax/V	Imax/A
Th=27℃	70.4	1.46	1.80	1.4
Th=50℃	79.2	1.68	1.94	1.36
Ta=25℃	ACR/ Ω：0.965-1.180

TEM1-010012A-NM-3B

Material
1	PN pellets:10 pairs
2	Cold and hot surface ceramic substrate material: ALN
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Thickness :20um/4.5±1.5um/0.075um/0.1um
4	Solder layer material composition: Au78Sn22; Maximum allowable process temperature 265℃, 2min

Parameter
TEM1-010012A-NM-3B	△Tmax/℃	Qc max/W	Umax/V	Imax/A
Th=27℃	70.92	0.87	1.15	1.21
Th=85℃	93.97	1.10	1.50	1.18
Ta=27℃	ACR/ Ω：0.74-0.90

TEM1-008012A-NM-3B

Material
1	PN pellets:8 pairs
2	Cold and hot surface ceramic substrate material: ALN
3	Surface metallized layer material composition :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um; Pad partial metallization layer :Cu/Ni/Pd/Au; Au: 0.1 ~ 0.15 um
4	Solder layer material composition: AuSn

Parameter
TEM1-008012A-NM-3B	△Tmax/℃	Qc max/W	Umax/V	Imax/A
Th=27℃	70	0.64	0.96	1.09
Th=50℃	79	0.74	1.03	1.16
Ta=25℃	ACR/ Ω：0.58-0.74

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