Huahai Technology Development Co., Ltd.

TEM1-018010B-NM-3B

Micro TEC

Micro TEC TEM1-018010B-NM-3B

Material
1	PN pellets:18 pairs
2	Cold and hot surface ceramic substrate material: ALN
3	Surface metallized layer material composition: Cu/Ni/Pd/Au: Thickness: 20um/3~7um/0.075um/0.1~0.15um
4	Solder layer material composition: AuSn; Maximum allowable process temperature 265℃, 2min

Parameter
TEM1-018010B-NM-3B	△Tmax/℃	Qc max/W	Umax/V	Imax/A
Th=27℃	70.3	1.3	2.1	1.0
Th=50℃	81.6	1.4	2.3	1.0
Ta=27℃	ACR/ Ω：1.576±10%

TEM1-018010B-NM-3B

TEM1-018010B-NM-3B型TEC规格书.pdf

The product adopts high-performance thermoelectric materials and special manufacturing process, and has the characteristics of small size, high power density and high reliability. It is typically used in 10G DWDM optical modules, 100G LR4/ER4/ZR4 optical modules, coherent modules, 400G/800G optical modules in data centers, and automotive lidars in optical communication transmission networks.