華海科学技術発展有限公司

製品

お客様に専門的な半導体熱電技術ソリューションと応用製品を提供する

現在の場所：トップページ > 製品

Micro TEC ねつでんれいきゃくき(TEC) 熱電冷却アセンブリ（TEA）温度差発電素子 (おんどさはつでんそし)

TEM1-018010B-NM-3B

Micro TEC

Micro TEC TEM1-018010B-NM-3B

Material
1	PN pellets:18 pairs
2	Cold and hot surface ceramic substrate material: ALN
3	Surface metallized layer material composition: Cu/Ni/Pd/Au: Thickness: 20um/3~7um/0.075um/0.1~0.15um
4	Solder layer material composition: AuSn; Maximum allowable process temperature 265℃, 2min

Parameter
TEM1-018010B-NM-3B	△Tmax/℃	Qc max/W	Umax/V	Imax/A
Th=27℃	70.3	1.3	2.1	1.0
Th=50℃	81.6	1.4	2.3	1.0
Ta=27℃	ACR/ Ω：1.576±10%

TEM1-018010B-NM-3B

TEM1-018010B-NM-3B型TEC规格书.pdf

The product adopts high-performance thermoelectric materials and special manufacturing process, and has the characteristics of small size, high power density and high reliability. It is typically used in 10G DWDM optical modules, 100G LR4/ER4/ZR4 optical modules, coherent modules, 400G/800G optical modules in data centers, and automotive lidars in optical communication transmission networks.

0755-28508170